Inline gas diagnostics for vacuum systems

Understand vacuum
instead of only measuring pressure.

Total pressure alone is not enough.

A pressure value shows that something is changing. TOF300 shows what is actually happening in the vacuum: gas composition, leak signatures, contamination, and process drift, directly at the machine.

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Applications Team & Vision Contact

Developed in Jena for coating, semiconductor, OEM, and R&D applications.

TOF300 · Live spectrum Pump-down
TOF300 spectrum
Total pressure baseline
t = 0.0 s
1-300
amu mass range
10 ms
measurement time / spectrum
< 5 cm
sensor head length
2026
field-test ready
Why gas diagnostics

From "something is wrong"
to "we can see why".

Today - total pressure only

You see the pressure, but not why it changes.

  • Pump-down takes longer, but the cause is unclear
  • Contamination increases, but the source is unknown
  • A leak signature is present, but the gas is unidentified
  • Process drift is visible, but there is no gas picture
With TOF300

Pressure and gas composition become visible at the same time.

  • H₂O, N₂, CO₂, and hydrocarbons directly in the mass channel
  • Specific leak signatures become recognizable
  • Contamination sources can be localized earlier
  • Gas drift can be tracked continuously
Applications

What is really happening in the vacuum.

TOF300 reveals what remains hidden in total pressure.

Diagnostics

Pump-down analysis

See live whether water, air, or hydrocarbons are slowing down pump-down. Replace assumptions with direct indications of the actual cause.

Leak detection

Helium leak monitoring

Detect helium directly in the relevant mass channel and monitor leak signatures continuously in the process, without a separate leak detector.

Cleanliness

Contamination monitoring

Identify hydrocarbon signatures early, before they lead to scrap, additional cleaning, or process instability.

Process monitoring

Gas drift during operation

Track changes in gas composition in real time and detect drift, wrong dosing, or unwanted side gases before the process leaves its window.

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Positioning

More than a pressure sensor.
Simpler than classical residual gas analysis.

TOF300 closes the gap between simple total pressure measurement and complex classical gas analysis.

Established
Total pressure sensor only
  • Robust and established
  • Provides only summed information
  • No statement about gas type or root cause
New category
TOF300
  • Total pressure measurement and gas diagnostics
  • Heavy hydrocarbons up to m/z 300
  • Gas analysis up to 5 × 10⁻³ mbar
  • Continuous, robust, close to the process
Not just seeing that something happens. Seeing what happens.
High-end
Classical residual gas analysis
  • High information depth
  • Often more complex and expensive
  • Not always ideal close to robust inline environments
Industries

Where TOF300 makes the greatest difference.

Coating
Detect contamination, outgassing, and gas drift early, before layer quality and reproducibility suffer.
Semiconductor
Gas purity, process drift, and fast fault diagnostics directly in sensitive process steps.
OEM / Equipment
Diagnostic capability as a product feature, without integrating a separate high-end analyzer.
Research & Development
Learn faster by interpreting pump-down, leaks, and contamination directly.

Want to see what is really
happening in your process?

We are looking for field test partners in coating, semiconductor, special-purpose machinery, and research. If gas composition, leak signatures, or contamination matter in your application, talk to us.

Request field test access → More about the field test program